G.Skill International Enterprise, a leading provider of high performance memory, is launching a new heat spreader design for mid-high end memory. Based on providing better heat dissipation, G.Skill "π" series heat spreader design increases the air contact surface 100% more than traditional design. Under high voltage, G.Skill claims that "π" can lower the module temperature at least 20% to 30% more than other memory cooling systems. G.Skill's "π" series heat spreader will be implemented with a whole new "HZ" series of dual-channel kits ranging from DDR2-800 to DDR3-1600. These modules will be available through G.Skill’s authorized resellers and distributors worldwide.