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เป็นภาษาอังกฤษนะครับ
Introduction
In the PC industry HEAT is not just the by-product of ever increasing transistor counts and shrinking micro-processes, it’s also our arch nemesis. As the micro-processor industry seems to bear out Moore’s Law a multi-million dollar industry based on what are effectively ad hoc cooling solutions has evolved. One area where the term micro in micro-processing industry haunts us are those micro-pores and striations which exist in all heatsink base and IHS (Integrated Heat Spreader) surfaces. The illustrations below borrowed from the AMD white-paper Thermal Interface Material Comparison (pdf) and Koolance give an example of where these imperfections live.
The human eye cannot detect imperfections this minute and if left "untreated" you’re either going to experience very high processor temps affecting performance or CPU failure all together. Shortly after micro-processors began to produce more heat than their surfaces could dissipate the first heatsinks were born. At that point the need for a thermal interface material, to literally fill the gap in the new technology, was needed. As this new industry grew, choices and formulas for thermal interface materials were first on the R&D list. Silicon was the minimum standard and then metal based formulas hit the market. Silver in particular not only sounded great to the consumer, its high thermal conductivity made it an ideal ingredient (in small quantities). Of course it's not just conductivity, a TIM (Thermal Interface Material) must also fill surface gaps and hopefully displace the air that would remain without it. Air compared to Silver has a low conductivity as expressed in this formula W/m K = 0.026, while silver = 429.0. Between air and paste containing 10% silver, the latter seems a much better option.
The TIM industry has been working to develop the ultimate formula by attempting to incorporate those materials with the highest thermal conductivity and an ability to fill gaps. Of course those may be very important, but there are other attributes. AMD's white paper Thermal Interface Material Comparison lists five "Guidelines" or criteria for thermal interface materials. Listed verbatim they are:
• Thermal conductivity of the material
• Electrical conductivity of the material
• Spreading characteristics of the material
• Long-term stability and reliability of the material
• Ease of application
Electrical conductivity is of course high on the list and as we will discover this conundrum for manufacturers has prompted experimentation with many different materials. Albeit silver, silicon, or diamond most manufacturers have to consider all the guidelines if they want to produce a desirable product. Perhaps other criteria might be cost, although I really haven't heard too many PC-Enthusiasts complain once they've discovered how critical a robust thermal interface material is to the life of their processor.
1.) Arctic Cooling - MX-2
2.) Arctic Silver - AS5
3.) Arctic Silver - Ceramique
4.) Innovation Cooling - 7-Carat Thermal Compound
5.) Sunbeamtech - Tuniq TX-2
6.) ESG Nanotherm - PCM+
Onto thermal paste formulas ->
Formulas
As mentioned on the previous page, electrical conductivity is high on the list of criteria where TIM's are concerned. The macro photo above provides a clear example why TIM’s are not made with an extraordinarily high metal content. While higher metal content might out-perform most silicon or synthetics, metal conducts electricity. Looking at the amount of paste and the proximity of the capacitors on the North Bridge surface pictured above, if the paste should reach those SMD's a short would certainly occur damaging any number of components. While metal infused TIM’s held the performance reigns for sometime there was always that "danger" and confusion they conducted more then heat. Currently there are three general categories for TIM formulas including Silicon, Synthetics (ceramic based) and Metal pastes (small amount of trace metals). The search for the ideal TIM has produced some exotic products. One such product released in 2003 was Nanotherm PCM+. Developed by ESG Associates their formula was not only controversial, it was purportedly the first ever active Thermal Transfer Material.
When Nanotherm PCM+ (Phase Change Material) first arrived it truly impressed besting products from Arctic Silver as shown in our review here. The basis for PCM+ success (at least initially) was not so much the ingredients themselves, but how they supposedly worked. PCM+ was said to undergo a rapid phase change as the main proponent of it’s heat transfer mechanism. Thermal energy generated by the processor passed to the paste and the product changed from a liquid to a gaseous state and back again.
Unfortunately for Nanotherm questions were raised at several PC-Enthusiast Forums which then led to this article Mod Synergy entitled; Nanotherm PCM+ "The after effects raises questions". Nanotherm responded by making changes to their formula and after several revisions I have what may be a sample from that very last batch. PCM+ will be tested here today because of its unique place in TIM history.
TIM Specifics
PCM+ - Application method: spreading
# No info available
# Arctic Cooling MX-2 - Application Method (pdf)
# Appearance - Grey
# Viscosity - 285000 cP
# Thermal conductivity - 4.5W/mK
# Operating temperature - -45°C ~ 200°C
# Specific Gravity - 3.96 @ 25°C
# Volume - 3.5g
# MSRP - (excl. VAT):
5,95 € / US$ 7.95
Formulas
Madshrimps (c)
As mentioned on the previous page, electrical conductivity is high on the list of criteria where TIM's are concerned. The macro photo above provides a clear example why TIM’s are not made with an extraordinarily high metal content. While higher metal content might out-perform most silicon or synthetics, metal conducts electricity. Looking at the amount of paste and the proximity of the capacitors on the North Bridge surface pictured above, if the paste should reach those SMD's a short would certainly occur damaging any number of components. While metal infused TIM’s held the performance reigns for sometime there was always that "danger" and confusion they conducted more then heat. Currently there are three general categories for TIM formulas including Silicon, Synthetics (ceramic based) and Metal pastes (small amount of trace metals). The search for the ideal TIM has produced some exotic products. One such product released in 2003 was Nanotherm PCM+. Developed by ESG Associates their formula was not only controversial, it was purportedly the first ever active Thermal Transfer Material.
Madshrimps (c)
When Nanotherm PCM+ (Phase Change Material) first arrived it truly impressed besting products from Arctic Silver as shown in our review here. The basis for PCM+ success (at least initially) was not so much the ingredients themselves, but how they supposedly worked. PCM+ was said to undergo a rapid phase change as the main proponent of it’s heat transfer mechanism. Thermal energy generated by the processor passed to the paste and the product changed from a liquid to a gaseous state and back again.
Unfortunately for Nanotherm questions were raised at several PC-Enthusiast Forums which then led to this article Mod Synergy entitled; Nanotherm PCM+ "The after effects raises questions". Nanotherm responded by making changes to their formula and after several revisions I have what may be a sample from that very last batch. PCM+ will be tested here today because of its unique place in TIM history.
TIM Specifics
PCM+ - Application method: spreading
# No info available
Madshrimps (c)
Arctic Cooling MX-2 - Application Method (pdf)
# Appearance - Grey
# Viscosity - 285000 cP
# Thermal conductivity - 4.5W/mK
# Operating temperature - -45°C ~ 200°C
# Specific Gravity - 3.96 @ 25°C
# Volume - 3.5g
# MSRP - (excl. VAT):
5,95 € / US$ 7.95
Madshrimps (c)
Arctic Silver Ceramique - Application Method
# Thermal Resistance - <0.007°C-in2/Watt (0.001 inch layer)
# Thermal Conductance - >200,000W/m2.°C (0.001 inch layer)
# Average Particle Size - <0.38 microns <0.000015 inch
( 67 particles lined up in a row equal 1/1000th of an inch. )
# Temperature limits - Peak: –150°C to >180°C Long-Term: –150°C to 125°C
# MSRP - $4.99 (2.5g)
# Arctic Silver AS5 - Application Method
# Thermal Conductance - >350,000W/m2 °C (0.001 inch layer)
# Thermal Resistance - <0.0045°C-in2/Watt (0.001 inch layer)
# Average Particle Size - <0.49 microns <0.000020 inch
# Extended Temperature Limits - Peak: –50°C to >180°C Long-Term: –50°C to 130°C
# Performance - 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
# MSRP - $5.99 (3.5g)
# Tuniq TX-2 - Application Method - none specified
# Appearance - Grey
# Viscosity - 285000 cP
# Thermal conductivity - 4.5W/mK
# Operating temperature - -45°C ~ 200°C
# Specific Gravity - 3.96 @ 25°C
# Volume - 3.5g
# MSRP - $5.99
Testing Methods
The stock cooler above will be the only heatsink used in this round-up. However there are problems with Intel's stock heatsink foremost being its push-pin mounting system. Made of plastic they have finite lifespan and repeated installations can eventually cause damage. Intel wanted to make things easy for PC-Hobbyists and push-pins were the solution. Given the number of times I would be removing the cooler to re-install thermal pastes, I decided upon a modification.
The mounting system pictured is similar to what I use for certain water-blocks which have problematic mounting hardware themselves. The testing process involved repeated installations to find the best "mount." For each paste I chose the best of three installs, which became a time consuming process. Cleaning the heatsink and IHS between installations used almost all my Arctic Silver ArcticClean.
The only installation which could not be repeated was the Intel's factory installed thermal material. Comparing the effects (if any) of different application methods such as spreading or the dollop method then doubled the overall number of installations. The dollop method involves placing a drop in the center or thin line of paste across the IHS and then simply mounting the heatsink ensuring the pressure is evenly distributed. The theory behind the dollop application is that "compressing" rather then spreading the paste forces air out and thermal material into the gaps along both surfaces.
As seen above Intel uses a combination installing their factory paste. We can see that the paste below is already spread and when the heatsink is installed TIM will be compressed filling the gaps and ideally displacing the air from those surface gaps. Examining differences between different application methods involved taking photos of both the heatsink base and IHS before and after.
Intel factory installed paste distributed evenly under the mounting pressure. A certain benefit of Socket 775 is the clamping mechanism which holds down the CPU. This prevents the CPU from potential damage as in Ziff Sockets when the CPU is pulled out attached to the heatsink. Even with the Ziff locked I've had this occur so many times I began unlocking the small lever, at least as far as I could. Note the large ridge of paste at the right of the photo.
Ultimately temps will provide the best proof for the specific application method ->
Application Results
One reason I chose to include a paste which is technically defunct was its unique characteristics. While most thermal interface materials go through some form of phase change, PCM+ claimed to undergo phase change repeatedly as a proponent of its design.
In the photos above revealing Nanotherm PCM+ after testing, the application method used was spreading. If you've spent enough time in overclocking forums your probably familiar with the ongoing debate concerning TIM application. Essentially two schools of thought exist. Spreading - in which an even layer is distributed over the entire IHS (Integrated Heat Spreader) surface using a flat edged card or other object. And Dollop - in which a large drop or dollop of paste is deposited onto the center of the IHS and then the heatsink is mounted. Where-as spreading can incorporate tiny air-bubbles, compressing the paste should force more air out. Here we'll look at some examples before and after.
Tuniq TX-2 recommends using the dollop method applying their paste. Its consistency is more viscous compared to most thermal pastes. In the photo above I spread TX-2 covering the entire IHS. The photo below was taken after 7-days of testing cycling temps between IDLE and LOAD. In the thumbnails below an example of Tuniq TX-2 applied using the dollop method on the Danger Den TDX.
Application Results
Madshrimps (c)
One reason I chose to include a paste which is technically defunct was its unique characteristics. While most thermal interface materials go through some form of phase change, PCM+ claimed to undergo phase change repeatedly as a proponent of its design.
Madshrimps (c)
In the photos above revealing Nanotherm PCM+ after testing, the application method used was spreading. If you've spent enough time in overclocking forums your probably familiar with the ongoing debate concerning TIM application. Essentially two schools of thought exist. Spreading - in which an even layer is distributed over the entire IHS (Integrated Heat Spreader) surface using a flat edged card or other object. And Dollop - in which a large drop or dollop of paste is deposited onto the center of the IHS and then the heatsink is mounted. Where-as spreading can incorporate tiny air-bubbles, compressing the paste should force more air out. Here we'll look at some examples before and after.
Madshrimps (c)
Tuniq TX-2 recommends using the dollop method applying their paste. Its consistency is more viscous compared to most thermal pastes. In the photo above I spread TX-2 covering the entire IHS. The photo below was taken after 7-days of testing cycling temps between IDLE and LOAD. In the thumbnails below an example of Tuniq TX-2 applied using the dollop method on the Danger Den TDX.
Madshrimps (c)
Madshrimps (c) Madshrimps (c)
Tuniq TX-2 retained more moisture then any other sample tested, albeit under the recommended dollop method or spread as seen above. I was most impressed with TX-2 and one reason I believe this paste is such a strong performer is in its ability to retain moisture longer then other pastes.
AC’s MX-2 is a synthetic ceramic paste which has similarities to TX-2 insofar as its high moisture content. The flow rate makes it easy to apply whether you're spreading the paste or using the dollop method. MX-2 also recommends the dollop applications method.
After seven days MX-2 did lose some moisture. I noticed several of the pastes tested had great consistency out of the syringe, but after 7-days viscosity and texture can be completely different. Note the distribution of the paste which may seem inadequate until you realize the cores beneath the IHS only account for about 70% of its total area.
I find this method of application very revealing since it matters not if you were to spread the paste over the entire area of the IHS. Spreading the paste is not going to improve the contact area between the two surfaces. Only lapping your heatsink will do this. Problem is, just about any changes you make even using an OEM thermal interface material voids your processor warranty.
Onto our test results and conclusion ->
Testing
Arctic Silver ArcticClean was used to clean both the IHS and heatsink base between tests. I know of no other cleaning and preparation product on the market which works effectively as ArctiClean. Prepping your thermal transfer surfaces is just as important as the TIM you’re applying and how you apply it. On a side-note Arctic Silver also hosts what must be the most in-depth instruction pages of any TIM maker. Below I've illustrated a photo to show their recommended "line" across the IHS application for Quad Core. The water block pictured above with the phenomenal finish is Koolance CPU330.
Intel Test System
CPU Intel Quad Core Q6600 Retail 2.40GHz (1.285V) Socket-775
Mainboards Gigabyte GA-P35C-DS3R
Memory OCZ Technology DDR3-1066 (2x1MB)
Graphics BFG 8800GTX
Power Supply NZXT Precise 1200W
Storage / Optical Seagate Barracuda ST30815AS / Plextor 760SA
Cooling Intel Stock Cooler used through out
Operating System Windows XP
Test Methodology:
In order to simulate a 100% LOAD to all four cores I chose Prime95 v25.5a. This and Orthos X are the only two programs which currently support Quad core testing. Core temps were recorded using Core Temp 0.95 and an average was calculated from the values. To increase wattage beyond the processor's TDP our Q6600 was overclocked from 2.4GHz to 3.0GHz (Vcore 1.28V / 9x334FSB) for a baseline 128W at IDLE. I recorded every result with a crop of Prime95 and Core Temp 0.95. An example can be found in the thumbnail below (temps are exceptionally low in this example as it represents H20 temps under LOAD)...
In every test I applied a specifc paste then cycled between IDLE and LOAD as produced by Prime95. After 7-days I removed the heatsink and photographed the IHS and heatsink base. For each paste I repeated the process above three times for each paste and for each application method to ensure I was getting solid contact and spread. I chose the lowest temp out of these multiple mounts for use in our results. In theory this should have given us the best contact (heat transfer). Throughout these tests I made sure the Ambient temp remained at a steadfast 21°C.
The charts are separated by application method.
Conclusive Thoughts
With the exception of Intel's factory installed thermal interface material, the temp difference between pastes was relatively close. Clearly synthetic blend pastes are now dominating the market and while silver infused products have great potential they are not the competition killers they once were.
By the criteria laid out on the first page:
# Thermal conductivity of the material
# Electrical conductivity of the material
# Spreading characteristics of the material
# Long-term stability and reliability of the material
# Ease of application
In the list below in order of the best performer first, reflects the criteria above as best as possible:
1. Tuniq TX2
2. Arctic Silver AS5
3. Arctic Cooling MX-2
4. Arctic Silver Ceramique
5. Nanotherm PCM+
6. Intel stock thermal interface material
The number of pastes tested today doesn’t come close to what’s out there. One thermal interface material in particular I wanted to test was Innovation Cooling's IC Diamond 7 Carat Thermal Compound which in theory has the ideal formula, and CooLaboratory LiquidMetal Pad different from their Liquid Metal Pro. After the holidays I will be repeating these tests including the products mentioned on both a simulated-die and on the Q6600.
If you’re in the market for a new tube of thermal paste, I would strongly recommend Tuniq TX-2 as your next choice. It out performed the competition tested here, it’s much easier to apply and remove, and requires no spreading. Initially I mentioned price, but when you think about the role your TIM plays in the scheme on things their all invaluable and whether one paste is a few dollars more or less pales in comparison.
I would like to thank all the manufacturers fro submitting samples
หมดแล้วครับ ที่เค้าแนะนำคือ Tuniq TX2 ครับ
เป็นภาษาอังกฤษนะครับ
Introduction
In the PC industry HEAT is not just the by-product of ever increasing transistor counts and shrinking micro-processes, it’s also our arch nemesis. As the micro-processor industry seems to bear out Moore’s Law a multi-million dollar industry based on what are effectively ad hoc cooling solutions has evolved. One area where the term micro in micro-processing industry haunts us are those micro-pores and striations which exist in all heatsink base and IHS (Integrated Heat Spreader) surfaces. The illustrations below borrowed from the AMD white-paper Thermal Interface Material Comparison (pdf) and Koolance give an example of where these imperfections live.
The human eye cannot detect imperfections this minute and if left "untreated" you’re either going to experience very high processor temps affecting performance or CPU failure all together. Shortly after micro-processors began to produce more heat than their surfaces could dissipate the first heatsinks were born. At that point the need for a thermal interface material, to literally fill the gap in the new technology, was needed. As this new industry grew, choices and formulas for thermal interface materials were first on the R&D list. Silicon was the minimum standard and then metal based formulas hit the market. Silver in particular not only sounded great to the consumer, its high thermal conductivity made it an ideal ingredient (in small quantities). Of course it's not just conductivity, a TIM (Thermal Interface Material) must also fill surface gaps and hopefully displace the air that would remain without it. Air compared to Silver has a low conductivity as expressed in this formula W/m K = 0.026, while silver = 429.0. Between air and paste containing 10% silver, the latter seems a much better option.
The TIM industry has been working to develop the ultimate formula by attempting to incorporate those materials with the highest thermal conductivity and an ability to fill gaps. Of course those may be very important, but there are other attributes. AMD's white paper Thermal Interface Material Comparison lists five "Guidelines" or criteria for thermal interface materials. Listed verbatim they are:
• Thermal conductivity of the material
• Electrical conductivity of the material
• Spreading characteristics of the material
• Long-term stability and reliability of the material
• Ease of application
Electrical conductivity is of course high on the list and as we will discover this conundrum for manufacturers has prompted experimentation with many different materials. Albeit silver, silicon, or diamond most manufacturers have to consider all the guidelines if they want to produce a desirable product. Perhaps other criteria might be cost, although I really haven't heard too many PC-Enthusiasts complain once they've discovered how critical a robust thermal interface material is to the life of their processor.
Thermal Pastes Tested:
1.) Arctic Cooling - MX-2
2.) Arctic Silver - AS5
3.) Arctic Silver - Ceramique
4.) Innovation Cooling - 7-Carat Thermal Compound
5.) Sunbeamtech - Tuniq TX-2
6.) ESG Nanotherm - PCM+
Onto thermal paste formulas ->
Formulas
As mentioned on the previous page, electrical conductivity is high on the list of criteria where TIM's are concerned. The macro photo above provides a clear example why TIM’s are not made with an extraordinarily high metal content. While higher metal content might out-perform most silicon or synthetics, metal conducts electricity. Looking at the amount of paste and the proximity of the capacitors on the North Bridge surface pictured above, if the paste should reach those SMD's a short would certainly occur damaging any number of components. While metal infused TIM’s held the performance reigns for sometime there was always that "danger" and confusion they conducted more then heat. Currently there are three general categories for TIM formulas including Silicon, Synthetics (ceramic based) and Metal pastes (small amount of trace metals). The search for the ideal TIM has produced some exotic products. One such product released in 2003 was Nanotherm PCM+. Developed by ESG Associates their formula was not only controversial, it was purportedly the first ever active Thermal Transfer Material.
When Nanotherm PCM+ (Phase Change Material) first arrived it truly impressed besting products from Arctic Silver as shown in our review here. The basis for PCM+ success (at least initially) was not so much the ingredients themselves, but how they supposedly worked. PCM+ was said to undergo a rapid phase change as the main proponent of it’s heat transfer mechanism. Thermal energy generated by the processor passed to the paste and the product changed from a liquid to a gaseous state and back again.
Unfortunately for Nanotherm questions were raised at several PC-Enthusiast Forums which then led to this article Mod Synergy entitled; Nanotherm PCM+ "The after effects raises questions". Nanotherm responded by making changes to their formula and after several revisions I have what may be a sample from that very last batch. PCM+ will be tested here today because of its unique place in TIM history.
TIM Specifics
PCM+ - Application method: spreading
# No info available
# Arctic Cooling MX-2 - Application Method (pdf)
# Appearance - Grey
# Viscosity - 285000 cP
# Thermal conductivity - 4.5W/mK
# Operating temperature - -45°C ~ 200°C
# Specific Gravity - 3.96 @ 25°C
# Volume - 3.5g
# MSRP - (excl. VAT):
5,95 € / US$ 7.95
Formulas
Madshrimps (c)
As mentioned on the previous page, electrical conductivity is high on the list of criteria where TIM's are concerned. The macro photo above provides a clear example why TIM’s are not made with an extraordinarily high metal content. While higher metal content might out-perform most silicon or synthetics, metal conducts electricity. Looking at the amount of paste and the proximity of the capacitors on the North Bridge surface pictured above, if the paste should reach those SMD's a short would certainly occur damaging any number of components. While metal infused TIM’s held the performance reigns for sometime there was always that "danger" and confusion they conducted more then heat. Currently there are three general categories for TIM formulas including Silicon, Synthetics (ceramic based) and Metal pastes (small amount of trace metals). The search for the ideal TIM has produced some exotic products. One such product released in 2003 was Nanotherm PCM+. Developed by ESG Associates their formula was not only controversial, it was purportedly the first ever active Thermal Transfer Material.
Madshrimps (c)
When Nanotherm PCM+ (Phase Change Material) first arrived it truly impressed besting products from Arctic Silver as shown in our review here. The basis for PCM+ success (at least initially) was not so much the ingredients themselves, but how they supposedly worked. PCM+ was said to undergo a rapid phase change as the main proponent of it’s heat transfer mechanism. Thermal energy generated by the processor passed to the paste and the product changed from a liquid to a gaseous state and back again.
Unfortunately for Nanotherm questions were raised at several PC-Enthusiast Forums which then led to this article Mod Synergy entitled; Nanotherm PCM+ "The after effects raises questions". Nanotherm responded by making changes to their formula and after several revisions I have what may be a sample from that very last batch. PCM+ will be tested here today because of its unique place in TIM history.
TIM Specifics
PCM+ - Application method: spreading
# No info available
Madshrimps (c)
Arctic Cooling MX-2 - Application Method (pdf)
# Appearance - Grey
# Viscosity - 285000 cP
# Thermal conductivity - 4.5W/mK
# Operating temperature - -45°C ~ 200°C
# Specific Gravity - 3.96 @ 25°C
# Volume - 3.5g
# MSRP - (excl. VAT):
5,95 € / US$ 7.95
Madshrimps (c)
Arctic Silver Ceramique - Application Method
# Thermal Resistance - <0.007°C-in2/Watt (0.001 inch layer)
# Thermal Conductance - >200,000W/m2.°C (0.001 inch layer)
# Average Particle Size - <0.38 microns <0.000015 inch
( 67 particles lined up in a row equal 1/1000th of an inch. )
# Temperature limits - Peak: –150°C to >180°C Long-Term: –150°C to 125°C
# MSRP - $4.99 (2.5g)
# Arctic Silver AS5 - Application Method
# Thermal Conductance - >350,000W/m2 °C (0.001 inch layer)
# Thermal Resistance - <0.0045°C-in2/Watt (0.001 inch layer)
# Average Particle Size - <0.49 microns <0.000020 inch
# Extended Temperature Limits - Peak: –50°C to >180°C Long-Term: –50°C to 130°C
# Performance - 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
# MSRP - $5.99 (3.5g)
# Tuniq TX-2 - Application Method - none specified
# Appearance - Grey
# Viscosity - 285000 cP
# Thermal conductivity - 4.5W/mK
# Operating temperature - -45°C ~ 200°C
# Specific Gravity - 3.96 @ 25°C
# Volume - 3.5g
# MSRP - $5.99
Testing Methods
The stock cooler above will be the only heatsink used in this round-up. However there are problems with Intel's stock heatsink foremost being its push-pin mounting system. Made of plastic they have finite lifespan and repeated installations can eventually cause damage. Intel wanted to make things easy for PC-Hobbyists and push-pins were the solution. Given the number of times I would be removing the cooler to re-install thermal pastes, I decided upon a modification.
The mounting system pictured is similar to what I use for certain water-blocks which have problematic mounting hardware themselves. The testing process involved repeated installations to find the best "mount." For each paste I chose the best of three installs, which became a time consuming process. Cleaning the heatsink and IHS between installations used almost all my Arctic Silver ArcticClean.
The only installation which could not be repeated was the Intel's factory installed thermal material. Comparing the effects (if any) of different application methods such as spreading or the dollop method then doubled the overall number of installations. The dollop method involves placing a drop in the center or thin line of paste across the IHS and then simply mounting the heatsink ensuring the pressure is evenly distributed. The theory behind the dollop application is that "compressing" rather then spreading the paste forces air out and thermal material into the gaps along both surfaces.
As seen above Intel uses a combination installing their factory paste. We can see that the paste below is already spread and when the heatsink is installed TIM will be compressed filling the gaps and ideally displacing the air from those surface gaps. Examining differences between different application methods involved taking photos of both the heatsink base and IHS before and after.
Intel factory installed paste distributed evenly under the mounting pressure. A certain benefit of Socket 775 is the clamping mechanism which holds down the CPU. This prevents the CPU from potential damage as in Ziff Sockets when the CPU is pulled out attached to the heatsink. Even with the Ziff locked I've had this occur so many times I began unlocking the small lever, at least as far as I could. Note the large ridge of paste at the right of the photo.
Ultimately temps will provide the best proof for the specific application method ->
Application Results
One reason I chose to include a paste which is technically defunct was its unique characteristics. While most thermal interface materials go through some form of phase change, PCM+ claimed to undergo phase change repeatedly as a proponent of its design.
In the photos above revealing Nanotherm PCM+ after testing, the application method used was spreading. If you've spent enough time in overclocking forums your probably familiar with the ongoing debate concerning TIM application. Essentially two schools of thought exist. Spreading - in which an even layer is distributed over the entire IHS (Integrated Heat Spreader) surface using a flat edged card or other object. And Dollop - in which a large drop or dollop of paste is deposited onto the center of the IHS and then the heatsink is mounted. Where-as spreading can incorporate tiny air-bubbles, compressing the paste should force more air out. Here we'll look at some examples before and after.
Tuniq TX-2 recommends using the dollop method applying their paste. Its consistency is more viscous compared to most thermal pastes. In the photo above I spread TX-2 covering the entire IHS. The photo below was taken after 7-days of testing cycling temps between IDLE and LOAD. In the thumbnails below an example of Tuniq TX-2 applied using the dollop method on the Danger Den TDX.
Application Results
Madshrimps (c)
One reason I chose to include a paste which is technically defunct was its unique characteristics. While most thermal interface materials go through some form of phase change, PCM+ claimed to undergo phase change repeatedly as a proponent of its design.
Madshrimps (c)
In the photos above revealing Nanotherm PCM+ after testing, the application method used was spreading. If you've spent enough time in overclocking forums your probably familiar with the ongoing debate concerning TIM application. Essentially two schools of thought exist. Spreading - in which an even layer is distributed over the entire IHS (Integrated Heat Spreader) surface using a flat edged card or other object. And Dollop - in which a large drop or dollop of paste is deposited onto the center of the IHS and then the heatsink is mounted. Where-as spreading can incorporate tiny air-bubbles, compressing the paste should force more air out. Here we'll look at some examples before and after.
Madshrimps (c)
Tuniq TX-2 recommends using the dollop method applying their paste. Its consistency is more viscous compared to most thermal pastes. In the photo above I spread TX-2 covering the entire IHS. The photo below was taken after 7-days of testing cycling temps between IDLE and LOAD. In the thumbnails below an example of Tuniq TX-2 applied using the dollop method on the Danger Den TDX.
Madshrimps (c)
Madshrimps (c) Madshrimps (c)
Tuniq TX-2 retained more moisture then any other sample tested, albeit under the recommended dollop method or spread as seen above. I was most impressed with TX-2 and one reason I believe this paste is such a strong performer is in its ability to retain moisture longer then other pastes.
AC’s MX-2 is a synthetic ceramic paste which has similarities to TX-2 insofar as its high moisture content. The flow rate makes it easy to apply whether you're spreading the paste or using the dollop method. MX-2 also recommends the dollop applications method.
After seven days MX-2 did lose some moisture. I noticed several of the pastes tested had great consistency out of the syringe, but after 7-days viscosity and texture can be completely different. Note the distribution of the paste which may seem inadequate until you realize the cores beneath the IHS only account for about 70% of its total area.
I find this method of application very revealing since it matters not if you were to spread the paste over the entire area of the IHS. Spreading the paste is not going to improve the contact area between the two surfaces. Only lapping your heatsink will do this. Problem is, just about any changes you make even using an OEM thermal interface material voids your processor warranty.
Onto our test results and conclusion ->
Testing
Arctic Silver ArcticClean was used to clean both the IHS and heatsink base between tests. I know of no other cleaning and preparation product on the market which works effectively as ArctiClean. Prepping your thermal transfer surfaces is just as important as the TIM you’re applying and how you apply it. On a side-note Arctic Silver also hosts what must be the most in-depth instruction pages of any TIM maker. Below I've illustrated a photo to show their recommended "line" across the IHS application for Quad Core. The water block pictured above with the phenomenal finish is Koolance CPU330.
Intel Test System
CPU Intel Quad Core Q6600 Retail 2.40GHz (1.285V) Socket-775
Mainboards Gigabyte GA-P35C-DS3R
Memory OCZ Technology DDR3-1066 (2x1MB)
Graphics BFG 8800GTX
Power Supply NZXT Precise 1200W
Storage / Optical Seagate Barracuda ST30815AS / Plextor 760SA
Cooling Intel Stock Cooler used through out
Operating System Windows XP
Test Methodology:
In order to simulate a 100% LOAD to all four cores I chose Prime95 v25.5a. This and Orthos X are the only two programs which currently support Quad core testing. Core temps were recorded using Core Temp 0.95 and an average was calculated from the values. To increase wattage beyond the processor's TDP our Q6600 was overclocked from 2.4GHz to 3.0GHz (Vcore 1.28V / 9x334FSB) for a baseline 128W at IDLE. I recorded every result with a crop of Prime95 and Core Temp 0.95. An example can be found in the thumbnail below (temps are exceptionally low in this example as it represents H20 temps under LOAD)...
In every test I applied a specifc paste then cycled between IDLE and LOAD as produced by Prime95. After 7-days I removed the heatsink and photographed the IHS and heatsink base. For each paste I repeated the process above three times for each paste and for each application method to ensure I was getting solid contact and spread. I chose the lowest temp out of these multiple mounts for use in our results. In theory this should have given us the best contact (heat transfer). Throughout these tests I made sure the Ambient temp remained at a steadfast 21°C.
The charts are separated by application method.
Conclusive Thoughts
With the exception of Intel's factory installed thermal interface material, the temp difference between pastes was relatively close. Clearly synthetic blend pastes are now dominating the market and while silver infused products have great potential they are not the competition killers they once were.
By the criteria laid out on the first page:
# Thermal conductivity of the material
# Electrical conductivity of the material
# Spreading characteristics of the material
# Long-term stability and reliability of the material
# Ease of application
In the list below in order of the best performer first, reflects the criteria above as best as possible:
1. Tuniq TX2
2. Arctic Silver AS5
3. Arctic Cooling MX-2
4. Arctic Silver Ceramique
5. Nanotherm PCM+
6. Intel stock thermal interface material
The number of pastes tested today doesn’t come close to what’s out there. One thermal interface material in particular I wanted to test was Innovation Cooling's IC Diamond 7 Carat Thermal Compound which in theory has the ideal formula, and CooLaboratory LiquidMetal Pad different from their Liquid Metal Pro. After the holidays I will be repeating these tests including the products mentioned on both a simulated-die and on the Q6600.
If you’re in the market for a new tube of thermal paste, I would strongly recommend Tuniq TX-2 as your next choice. It out performed the competition tested here, it’s much easier to apply and remove, and requires no spreading. Initially I mentioned price, but when you think about the role your TIM plays in the scheme on things their all invaluable and whether one paste is a few dollars more or less pales in comparison.
I would like to thank all the manufacturers fro submitting samples
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