The Inquirer reporter "believes high-lead bumps are bad. That's his underlying theory. It's not true," Hara said.
He continued: "When you build a device, it's the material properties and everything in combination that leads to the robustness of the design. What we call the 'material set.' It's a combination of the underfill (a kind of a glue that helps hold the chip down) and the bump together that creates that stability in that connection," he said.
Hara talked about how the original problem announced by Nvidia on July 2 was rectified. "A more robust underfill would have taken the stress off the bumps and kept that (original problem) from happening. What we did was, we just simply went to a more robust underfill. Stopped using that (previous) underfill, kept using high-lead bumps, but we changed the underfill. And now we don't see the problem."