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Limitation breakthrough?! The initial look of DFI LP UT P35-T2R
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The 2nd half of my review
BIOS options
Boot-up screen
The main options for tweaking
Somehow its a characteristic of Intel chipset when overclocking
it will shutdown after tweaking. For that, DFI has 2 different modes to chose:
Mode 1) when the system was boot-up, it will run a little diagnose.
If the CPU frequency doesnt change too much, it will skip the shutdown
function and rewrite the clock generator directly.
Clock VCO Divider
This function is use to fix the clock generators divider and NB Strap by its
jumper. Then, system wouldnt be reboot again because it presumed itself is
not in an overclock status. (this function needs to cooperate with particular
jumper)
CPU FSB range: from 200 to 700MHz
Boot-up clock
This function can help you out by setting a lower boot up clock as a buffer,
when your FSB is tweaked too high in the beginning.
Memory Speed ratio option is really plentiful
CPU related functions
DRAM Timing details
Voltage related settings
The CPU voltage can be separated into 2 sections:
1st section is from 0.44375 to 1.6000V
2nd section is 100.23~ 130.00%
The range of DRAM: 1.710 to 3.040V
PC health status
I found that the copper bridge over the CPU and PWM area is a sufficient
way to dissipate heat form both of them. Hence, if the CPU cooler has a
better dissipation,
Itll help to carry out heat from other chipsets. .On the contrary, if the
Transpiper shows a better performance of heat dissipation, it also will help
CPU to carry out apart of the heat. I think they help each other .
The Transpiper can be extended to outside of the chassis. And let the PSU
fan to carry out the heat from inside the chassis. I think if I put a 8 x 8cm
fan onto south bridge part, the effect of heat conduction will be double.
The cooler installed
The copper bridge helps two parts to conduct heat.
Of course the thermal paste is needed...
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Test system detail
CPU:INTEL Core 2 Duo E6850
MB: DFI LP UT P35-T2R
DRAM:CORSAIR Dominator TWIN2X2048-8888C4DF
VGA:ELSA 860GT PH2 256B3 2DT RH
HD:WD1600AAJS
POWER:Corsair HX620W Modular Power Supply
Cooler:Thermaltake V1
At the previous part, I have already showed you the FSB test.
Its a pity I only have a Intel E6850 CPU, which is not that good in FSB tweaking.
Generally speaking, most of P35 board in market might be stable at FSB500.
But if the FSB overclock than 505 or above, that will made the system unable
to boot up or cant made the OS start up smoothly. DFIs LP UT P35-T2R can
get into OS stably under FSB522, more than that, it also can completely
finished a Super PI 32M.
Once I have a better CPU, Ill update a extreme FSB OC review then.
Actually, there was several very good review of FSB record around some HW sites.
6th Aug. version BIOS has enhanced DRAMs performance of this board.
It particularly improves a lot when memory such like Corsairs advanced tall
PCB modules. First, you can try to make the CLK fine delay option into 6.
(Notice: if you use this setting for short PCB DDRII modules, it may caused
hanging or shut down) Somehow, different PCB modules needed different LCK
fine delay settings, it has to spend so much time to find the answer.
If you follow the golden ratio of 500/1200 in DDRII CL5 5-5-15, I found that,
it only need 1.95V (BIOS default is 1.972V), 2 Super PI 32M can be done steady.
Even though the Enhance Data transmitting/ addressing has been set to Auto, the bandwidths performance is still better than some others.
For Intel chipset, It is really not easy to reach DDRII 1100~1200 under the
setting of CL4. On the other hand, the system also took only 2.44V (BIOS
default is 2.47V) to finish 2 Super PI 32M stably. Under same golden ratio
500/1200, DDRIICL4 4-4-9
The bandwidth looks great when memory under testing.
This is a quite outstanding OC record of Intel platform.
It finished the task under 1200 CL5 low voltage and 1200 CL4 settings.
3DMark2003 test.
DFI LP UT P35-T2R
The merits:
1)A good look and tasteful package design and related design
2)100% Japanese solid capacitors, 3 slots of PCIe x 16, which supports
CrossFire and physics rendering.
3)A unique heat piper cooler, Transpiper. It is real sufficient for heat
dissipation for inside or outside of the chassis.
4)Rich BIOS options for OC and voltage, especially an enhancement for Intel
chipsets characteristic that forced to shutdown and decrease voltage.
5)8 phases digital PWM and independent Bernstein audio module.
6)Seems the best FSB OC for all P35 board in the market. DDRII performance
is almost the same.
Defects:
1)It almost like a common failing that DFIs LP board is apparently higher price
in market. This model cost around USD$290.(I knew some area has priced
USD$260)
2)It should have a more detail but easy understanding install menu for
Transpiper to let users to install it quickly.
3)DFI P35 launched into market later than others manufacturer almost 2
months (before, they almost release new products that later than others up
to half year. It much better, but hope they can improve that after)
I heard a lot about X38 in this half year. Maybe most of mobo manufacturers
will launch their X38 in 1 or 2 months. But, leading brands keep launching new
P35 products. It proves how charming the P35 can be Besides, X38 only
born for DDR3, of course it has a better bandwidth for Crossfire. The spec.
comparison between P35 and X38 is quite similar to 965 and 975.
However, It is good to see that DFI did a good job with its LP P35. Obviously,
they have some improvements on OC ability and products creativity.
I agree this is a good choice when you want to have a try of P35 high-end motherboards.
This is my brief introduction though.
If I have found some thing further on audio or OC settings, Ill update that to
you guys. Thanks!!
windwithme next test...which one do you want to see?!
BIOSTAR TD35D3-A7 Deluxe
MSI P35 Diamond
DFI BLOOD-IRON(INFINITY P35)
ASUS P5K-Permium
GIGABYTE P35-DS3P
BENQ 241WZ
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