In contrast to Nvidia’s claims that only a limited number of GPUs are affected, sources indicated that "most" recent Nvidia GPUs carry the problem and a chance of failure, pushing the potential damage into stratospheric regions
the failures are caused by a solder bump that connects the I/O termination of the silicon chip to the pad on the substrate. In Nvidia’s GPUs, this solder bump is created using high-lead. A thermal mismatch between the chip and the substrate has substantially grown in recent chip generations, apparently leading to fatigue cracking. Add into the equation a growing chip size (double the chip dimension, quadruple the stress on the bump) as well as generally hotter chips and you may have the perfect storm to take high lead beyond its limits. Apparently, problems arise at what Nvidia claims to be "extreme temperatures" and what we hear may be temperatures not too much above 70 degrees Celsius.
Which chips are affected and are only notebook GPUs affected? According to our sources, both desktop chips and notebook chips are affected, but the issue is most likely to pop up in notebook chips due to the increased material constraints amplified by the turning on-and-off procedures. We heard that G84, G86 and G92 GPUs could show failures, but we were not able to confirm G94s